plating bath

Determination of Minim Copper in Nickel Plating Bath by Square Wave Stripping Voltammetry

方波溶出伏安法测定镀镍液中的微量铜

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Analyze the plating bath solution and incoming chemicals according to the procedures.

根据程序分析电镀槽液和进厂化学品.

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A Comparison on Several Stabilizing Agents in Acidic Tin Plating Bath

酸性镀锡液稳定剂的优选

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Co-Ni alloy coatings were electrodeposited from a sulfate plating bath and plating bath containing sodium citrate.

分别在硫酸盐镀液和添加柠檬酸钠的硫酸盐镀液中电沉积钴 - 镍合金.

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The principle of plating bronze by chemical displacement and control measures of coat composition are introduced. To reduce Sn 2+ content and add acidness of plating bath is beneficial to stabilization. To add addition can also raise stability of plating bath.

介绍置换镀锡青铜的原理及镀层成分控制措施，在镀液中降低Sn2+含量、增加镀液的酸度有利于镀液的稳定，加入添加剂也可提高镀液的稳定性。

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Factors Affecting lodine Titrimetric Analysis of Sn(ⅱ) in Acid Tin Plating Bath

碘量法测定酸性镀锡液中Sn（Ⅱ）含量的影响因素

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Rhodium in rhodium plating bath was determined by spectrophotometry with sodium hypochlorite as chromogenic agent.

用次氯酸钠作显色剂光度测定镀铑溶液中的铑.

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The effect of bismuth sulfate content in plating bath and current density on current efficiency, bismuth content and morphology of obtained tin-bismuth alloy was studied.

研究了镀液中硫酸铋含量和电流密度对镀层铋含量、电流效率及镀层表面形貌的影响。

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effects of time, order of adding reagents, contents of ethanediol, silver nitrate, acid copper plating bath and nitrate on scattering intensity of resonance light were studied.

讨论了乙二醇用量、硝酸银用量、酸性镀铜液（底液）用量、硝酸用量、时间及试剂加入顺序对共振光散射强度的影响。

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Rapid Determination of Nickel in the Acidic Brightening Tin Nickel Alloy Plating Bath

酸性光亮镀锡镍合金镀液中镍的快速测定

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The Potential Adjustment of an Additive in an Acid Tin& Lead Plating Bath

添加剂在酸性铅锡合金镀槽中的电位调节作用

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A new copper plating bath is found which capability is close to cyanide copper plating bath and can be the good substitute of cyanide copper plating bath in actual production.

本课题的目的是研究出一种在性能上与氰化镀铜液相近，并且在实际生产中也能够切实取代氰化镀铜工艺的无氰碱性镀铜工艺。

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Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation

锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠

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Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating.

采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层.

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Thus the tin was released from the plating bath using 2.5 g ammonium fluoride as the releasing agent in a acetic-pyridine buffer solution of a pH value 5.5, and then inversely titrated using zinc nitrate standard solution in the presence of xylenol orange as an indicator.

在pH值为5.5的醋酸吡啶缓冲溶液中，用2.5gNH4F解蔽，4滴XO、1mLCPB指示终点，锌盐返滴定镀液中的锡。

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Action Mechanism of Some Additives in Potassium Chloride Zinc Plating Bath

某些氯化钾镀锌添加剂的作用机理

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A bright chloride zinc plating bath containing a special brightener BDZ has been investigated.

本文论述了以BDZ为添加剂的氯化物镀锌工艺.

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0.05 to 0.1 grams per liter rare earth catalyst was added in acid tin plating bath. Bath stability was studied by accelerated oxidation test and exposure test.

在镀锡液中加入005～01g/L稀土催化剂，通过加速氧化试验和空气暴露试验研究了镀锡液的稳定性。

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Error Analysis and Concentration control of Free Cyanide in Copper Plating Bath

氰化镀铜液中游离氰化钠的分析误差和含量控制

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Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer.

利用比浊法,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子.

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The plating technology, bath formular, technological conditions and the coating properties of electrodeposited colourful chromium film in the low-chromium acid were introduced.

介绍了低铬酸电沉积彩色铬膜工艺及其膜层性能、电解液的最佳配方和工艺条件。

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Study of Operation and Maintenance of Bright Nickel Plating Bath without Sodium Salt

无钠盐光亮镀镍工艺操作及维护的研究

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The major problems of brush plating bath and the effect of soluble and non-soluble positive pole on various brush plating baths in iron plating are discussed.

本文研究了电刷镀铁镀液存在的主要问题，可溶性阳极和不溶性阳极对电刷镀铁不同类型镀液氧化的影响及原因。

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The Fe-SiC composite coatings were obtained through adding SiC particles into iron plating bath using a set of self-made asymmetry AC-DC power supply.

采用自制的不对称交直流电镀电源，在氯化亚铁镀铁液中加入SiC颗粒制备了Fe-SiC复合镀层。

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Silver cyanide and potassium silver cyanide are master salts of plating silver, and the quality of potassium silver cyanide has a great influence on the life of plating bath land coating. The high-purity of potassium silver cyanide is required by modern plating silver technique.

氰化银和氰化银钾是电镀银的主盐，其中氰化银钾的质量直接影响着镀层和镀液的寿命，现代镀银技术要求使用高纯度的氰化银钾。

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Some technical innovations inspired from practice Part ⅴ& Removal of copper impurity from acidic bright tin plating bath

实践逼出来的点滴创新第五部分&光亮酸性镀锡液中铜杂质的去除

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